Semiconductor package and method of forming the same

ABSTRACT

A semiconductor package includes a first package substrate, a first semiconductor chip disposed on the first package substrate, the semiconductor chip including first through hole vias, and a chip package disposed on the first semiconductor chip, the chip package including a second package substrate and a second semiconductor chip disposed on the second package substrate, wherein a first conductive terminal is disposed on a first surface of the semiconductor chip and a second conductive terminal is disposed on a first surface of the second package substrate, the first conductive terminal disposed on the second conductive terminal.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation claiming priority under 35 U.S.C.§120 to U.S. application Ser. No. 13/785,811, filed Mar. 5, 2013, whichis a Continuation under 35 U.S.C. §120 of U.S. application Ser. No.12/875,551, filed on Sep. 3, 2010, now U.S. Pat. No. 8,421,244, which isa Continuation-in-part under 35 U.S.C. §120 of U.S. application Ser. No.12/149,741, filed on May 7, 2008, now U.S. Pat. No. 8,022,555, whichclaims priority under 35 U.S.C. §119 to Korean Application No.10-2007-0044643, filed on May 8, 2007 in the Korean Patent Office(KIPO), the disclosures of each of the above applications are herebyincorporated herein by reference.

BACKGROUND

1. Technical Field

The present disclosure relates to semiconductor devices and methods offorming the same.

2. Description of the Related Art

A system in package (SIP) includes a plurality of integrated circuitsenclosed in a single package. The SIP can be typically used inside amobile phone or digital music player. Dies containing integratedcircuits, may be stacked vertically on a substrate.

SUMMARY

A semiconductor package may include a printed circuit board (PCB). Afirst semiconductor chip may be mounted on the PCB. A chip package maybe mounted on the first semiconductor chip. The chip package may be indirect contact with the first semiconductor chip.

A semiconductor package may include a printed circuit board (PCB), afirst semiconductor chip mounted on the PCB, an interposer in directcontact with the first semiconductor chip, a semiconductor chip groupmounted on the interposer, an encapsulation layer covering theinterposer and the semiconductor chip group, and/or a molding layercovering the encapsulation layer, the first semiconductor chip, and thePCB, wherein the interposer electrically connects the firstsemiconductor chip to the semiconductor chip group.

A method of forming a semiconductor package may include mounting a firstsemiconductor chip on a printed circuit board (PCB). A chip package maybe prepared and mounted on the first semiconductor chip. The chippackage may be mounted so as to be in direct contact with the firstsemiconductor chip.

A semiconductor package may include a first package substrate, a firstsemiconductor chip disposed on the first package substrate, thesemiconductor chip including first through hole vias, and a chip packagedisposed on the first semiconductor chip, the chip package including asecond package substrate and a second semiconductor chip disposed on thesecond package substrate, wherein a first conductive terminal isdisposed on a first surface of the first semiconductor chip and a secondconductive terminal is disposed on a first surface of the second packagesubstrate, the first conductive terminal disposed on the secondconductive terminal.

The semiconductor package may further include a third conductiveterminal disposed on a second surface of the first semiconductor chip,and a fourth conductive terminal disposed on a first surface of thefirst package substrate, the third conductive terminal disposed on thefourth conductive terminal. The first conductive terminal and the fourthconductive terminal may respectively include a bump pad and the secondconductive terminal and the third conductive terminal may respectivelyinclude a bump.

The semiconductor package may further include a redistribution linedisposed on the first surface of the first semiconductor chip andconnected to the first conductive terminal. The semiconductor packagemay further include a redistribution line disposed on a second surfaceof the first semiconductor chip and connected to the third conductiveterminal.

The first package substrate may include a PCB including an epoxycompound, resin or polyimide. The second package substrate may include aPCB including an epoxy compound, resin or polyimide. The second packagesubstrate may include silicon and may include second through hole viasdisposed in the second package substrate.

The first semiconductor chip and the second semiconductor chip can beelectrically connected by the second through hole vias, the firstconductive terminal, and the second conductive terminal. The firstsemiconductor chip and the first package substrate can be electricallyconnected by the first through hole vias, the third conductive terminal,and the fourth conductive terminal. The first semiconductor chip mayinclude a logic device and the second semiconductor chip may include amemory device.

A third semiconductor chip can be disposed between the firstsemiconductor chip and the first package substrate, the thirdsemiconductor chip may include third through hole vias. A size of thefirst semiconductor chip can be substantially same as a size of thethird semiconductor chip. Alternatively, a size of the firstsemiconductor chip can be different from a size of the thirdsemiconductor chip.

The second package substrate can be underfilled using an adhesive. Thefirst semiconductor chip can also be underfilled using an adhesive.

The semiconductor package may further include a first encapsulationlayer covering the chip package, and a second encapsulation layercovering the first encapsulation layer, the first semiconductor chip,and the first package substrate.

A semiconductor package may include a first package substrate, a firstsemiconductor chip disposed on the first package substrate, and a chippackage disposed on the first semiconductor chip, the chip packageincluding a second package substrate including an organic material and asecond semiconductor chip disposed on the second package substrate,wherein a first conductive terminal is disposed on a first surface ofthe first semiconductor chip and a second conductive terminal isdisposed on a first surface of the second package substrate, the firstconductive terminal disposed on the second conductive terminal.

A semiconductor package may include a first package substrate, a firstsemiconductor chip disposed on the first package substrate, thesemiconductor chip including first through hole vias, and a chip packagedisposed on the first semiconductor chip, the chip package including asecond package substrate including an organic material and a secondsemiconductor chip disposed on the second package substrate, wherein afirst conductive terminal is disposed on a first surface of thesemiconductor chip and a second conductive terminal is disposed on afirst surface of the second package substrate, the first conductiveterminal disposed on the second conductive terminal.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments herein can be understood in more detail from thefollowing descriptions taken in conjunction with the accompanyingdrawings, in which:

FIG. 1A is a cross-sectional view of a semiconductor package accordingto example embodiments.

FIG. 1B is a cross-sectional view of a semiconductor package accordingto example embodiments.

FIG. 2 and FIGS. 3A to 3D are cross-sectional views of a method offorming a semiconductor package according to example embodiments.

FIG. 4 is a cross-sectional view of a semiconductor package according toexample embodiments.

FIG. 5 is a cross-sectional view of a semiconductor package according toexample embodiments.

FIG. 6 is a cross-sectional view of a semiconductor package according toexample embodiments.

FIG. 7 is a cross-sectional view of a semiconductor package according toexample embodiments.

FIGS. 8, 9A-9C, and 10A-10C show a method of forming a semiconductorpackage according to example embodiments.

DETAILED DESCRIPTION

It will be understood that when an element or layer is referred to asbeing “on”, “connected to”, “coupled to”, or “covering” another elementor layer, it may be directly on, connected to, coupled to, or coveringthe other element or layer or intervening elements or layers may bepresent. Like numbers refer to like elements throughout thespecification. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third,etc. may be used herein to describe various elements, components,regions, layers, and/or sections, these elements, components, regions,layers, and/or sections should not be limited by these terms. Theseterms are only used to distinguish one element, component, region,layer, or section from another element, component, region, layer, orsection. Thus, a first element, component, region, layer, or sectiondiscussed below could be termed a second element, component, region,layer, or section without departing from the teachings of exampleembodiments.

Spatially relative terms, e.g., “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” may encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The terminology used herein is for the purpose of describing variousembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an,” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“includes,” “including,” “comprises,” and/or “comprising,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Example embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of exampleembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, example embodiments should not be construed aslimited to the shapes of regions illustrated herein but are to includedeviations in shapes that result, for example, from manufacturing.

Example embodiments will be described in further detail below withreference to the accompanying drawings. Example embodiments, however,may be embodied in many different forms and should not be construed aslimited to the examples set forth herein. In the drawings, thethicknesses of layers and/or regions may have been exaggerated forclarity.

FIG. 1A is a cross-sectional view of a semiconductor package accordingto example embodiments. Referring to FIG. 1A, the semiconductor packagemay include a printed circuit board (PCB) 10, a first semiconductor chip20 and a chip package P1. Lower substrate patterns 14 may be disposed ona lower surface of the PCB 10. Solder balls 16 may be adhered to thelower substrate patterns 14. The solder balls 16 may electricallyconnect the PCB 10 to an external circuit. Upper substrate patterns 12may be disposed on an upper surface of the PCB 10.

The first semiconductor chip 20 may be disposed on the PCB 10. Anadhesive layer (not shown) may be interposed between the firstsemiconductor chip 20 and the PCB 10. The first semiconductor chip 20may be a non-memory device (e.g., logic device). The first semiconductorchip 20 may include first bonding pads 22 disposed near the edge of theupper surface of the first semiconductor chip 20. The first bonding pads22 may be electrically connected to the upper substrate patterns 12 byfirst wires 26. First bump pads 24 may be disposed on the upper surfaceof the first semiconductor chip 20. The first bump pads 24 may bedisposed near the center of the upper surface of the first semiconductorchip 20.

The chip package P1 may be directly connected to the first semiconductorchip 20. The chip package P1 may include an interposer I, asemiconductor chip group 120 a, and an encapsulation layer 140. Theinterposer I may electrically connect the first semiconductor chip 20and the semiconductor chip group 120 a. The interposer I may include asemiconductor substrate 100 having through-hole vias 110, redistributionpatterns 103 connected to the through-hole vias 110, and first bumps 105connected to the redistribution patterns 103. The redistributionpatterns 103 may be disposed on an insulation layer (not shown) on alower surface of the semiconductor substrate 100. The first bumps 105may be disposed on the lower surface of the semiconductor substrate 100so as to be connected to the redistribution patterns 103 and the firstbump pads 24 on the first semiconductor chip 20.

The semiconductor chip group 120 a may be disposed on the interposer I.The semiconductor chip group 120 a may include a flip chip 122 a as asecond semiconductor chip, a third semiconductor chip 124 a, and afourth semiconductor chip 126 a. Second bumps 115 may be provided on thelower surface of the flip chip 122 a. The second bumps 115 may beconnected to the through-hole vias 110. The flip chip 122 a, the thirdsemiconductor chip 124 a, and the fourth semiconductor chip 126 a may bememory devices. Adhesive layers (not shown) may be interposed betweenthe flip chip 122 a and the third semiconductor chip 124 a and betweenthe third semiconductor chip 124 a and the fourth semiconductor chip 126a.

The third semiconductor chip 124 a and the fourth semiconductor chip 126a may be electrically connected to the through-hole vias 110 by secondwires 132 and third wires 134, respectively. An encapsulation layer 140may be provided so as to cover the semiconductor chip group 120 a andthe interposer I. The encapsulation layer 140 may include an epoxymolding compound (EMC). A molding layer 150 may be provided so as tocover the encapsulation layer 140, the first semiconductor chip 20, andthe PCB 10. The molding layer 150 may be formed of the same material asthe encapsulation layer 140. Alternatively, the molding layer 150 may beformed of a different material from the encapsulation layer 140.

The chip package P1 may be directly connected to the first semiconductorchip 20. Even when the locations of the bumps and pads of thesemiconductor chip group 120 a and the first semiconductor chip 20 havebeen modified, the semiconductor chip group 120 a and the firstsemiconductor chip 20 may still be connected to each other by means ofthe interposer I. Thus, a semiconductor package capable of relativelyhigh-speed operation may be realized, regardless of whether designmodifications may be needed in connection with the logic device and/ormemory device.

FIG. 1B is a cross-sectional view of a semiconductor package accordingto example embodiments. It should be understood that the description ofcommon features already discussed above will be omitted for brevity,while any new or different features will be described in further detailbelow. Referring to FIG. 1B, a semiconductor package may include aprinted circuit board (PCB) 10, a first semiconductor chip 20, and achip package P2. The PCB 10 may include upper substrate patterns 12,lower substrate patterns 14, and solder balls 16. The firstsemiconductor chip 20 may include first bonding pads 22 and first bumppads 24 on the upper surface of the first semiconductor chip 20. Firstwires 26 may be provided to electrically connect the first bonding pads22 and the upper substrate patterns 12.

The chip package P2 may be directly connected to the first semiconductorchip 20. The chip package P2 may include an interposer I, asemiconductor chip group 120 b, and an encapsulation layer 140. Theinterposer I may include a semiconductor substrate 100 havingthrough-hole vias 110, redistribution patterns 103 disposed on the lowersurface of the semiconductor substrate 100, and first bumps 105connected to the redistribution patterns 103.

The semiconductor chip group 120 b may include a second semiconductorchip 122 b, a third semiconductor chip 124 b, a fourth semiconductorchip 126 b, and a fifth semiconductor chip 128 b. The second, third, andfourth semiconductor chips 122 b, 124 b, and 126 b, respectively, may beelectrically connected to each other by penetration interconnections125. The penetration interconnections 125 may contact second bumps 115.The fifth semiconductor chip 128 b may include second bonding pads 136on its upper surface. The second bonding pads 136 may be electricallyconnected to the through-hole vias 110 by means of second wirings 135.

It should be understood that the chip packages P1 and P2 of FIG. 1 andFIG. 2, respectively, may be embodied in various forms and may includeadditional semiconductor chips. It should also be understood that thevarious shapes and forms of the semiconductor chip groups 120 a and 120b are only examples and should not to be construed to limit exampleembodiments of the present application.

FIG. 2 and FIGS. 3A to 3D are cross-sectional views of a method offorming a semiconductor package according to example embodiments.Referring to FIG. 2, a first semiconductor chip 20 may be mounted on aprinted circuit board (PCB) 10. The PCB 10 may include upper substratepatterns 12 on its upper surface and lower substrate patterns 14 on itslower surface. Solder balls 16 may be bonded to the lower substratepatterns 14 to provide a connection to an external circuit. The firstsemiconductor chip 20 may include first bonding pads 22 near the edgesof its upper surface. First wires 26 may connect the first bonding pads22 and the upper substrate patterns 12. First bump pads 24 may be formednear the center of the upper surface of the first semiconductor chip 20.

Referring to FIG. 3A, through-hole vias 110 may be formed in asemiconductor substrate 100. Forming the through-hole vias 110 mayinclude creating via holes in the semiconductor substrate 100 with alaser drill and filling the via holes with a conductive metal. The viaholes may be filled with a conductive metal using an electroplatingmethod.

Referring to FIG. 3B, first and second semiconductor chip groups 120 aand 120 b may be mounted on the semiconductor substrate 100. The firstsemiconductor chip group 120 a may include a flip chip 122 a as a secondsemiconductor chip, a third semiconductor chip 124 a, and a fourthsemiconductor chip 126 a. The flip chip 122 a may have second bumps 115on its lower surface. The second bumps 115 may be connected to thethrough-hole vias 110. The third semiconductor chip 124 a and the fourthsemiconductor chip 126 a may include second bonding pads 131 and thirdbonding pads 133, respectively. Second wires 132 may connect the secondbonding pads 131 and the through-hole vias 110. Third wires 134 mayconnect the third bonding pads 133 and the through-hole vias 110.

The second semiconductor chip group 120 b may include a secondsemiconductor chip 122 b, a third semiconductor chip 124 b, a fourthsemiconductor chip 126 b, and a fifth semiconductor chip 128 b. Thesecond, third, and fourth semiconductor chips 122 b, 124 b, and 126 bmay be electrically connected by penetration interconnections 125.Second bumps 115 may be formed on the lower surface of the secondsemiconductor chip 122 b so as to contact the penetrationinterconnections 125. The second bumps 115 may connect the through-holevias 110 in a flip chip manner. The fifth semiconductor chip 128 b mayinclude second bonding pads 136. Second wirings 135 may electricallyconnect the second bonding pads 136 and the through-hole vias 110.Although one form of the first and second semiconductor chip groups 120a and 120 b are discussed above, it should be understood that othervariations are also possible.

Referring to FIG. 3C, an encapsulation layer 140 may be formed so as tocover the upper surfaces of the first semiconductor chip group 120 a,the second semiconductor chip group 120 b, and the semiconductorsubstrate 100. The encapsulation layer 140 may be formed of an epoxymolding compound (EMC). The lower surface of the semiconductor substrate100 may be etched to reduce the thickness of the semiconductor substrate100. Etching the lower surface of the semiconductor substrate 100 mayinclude performing a mechanical polishing process followed by a wet etchprocess. The etching time may be reduced by performing the mechanicalpolishing process first.

Redistribution patterns 103 may be formed on the lower surface of thesemiconductor substrate 100 so as to contact the through-hole vias 110.First bumps 105 may be formed on the lower surface of the semiconductorsubstrate 100 so as to contact the redistribution patterns 103.Accordingly, an interposer I may include the semiconductor substrate100, the through-hole vias 110, the redistribution patterns 103, and thefirst bumps 105.

Referring to FIG. 3D, the semiconductor substrate 100 may be cut toseparate the first and second semiconductor chip groups 120 a and 120 b,thus generating a first chip package P1 and a second chip package P2.Before cutting the semiconductor substrate 100, a wafer level test maybe performed to identify devices of relatively high quality.

The first chip package P1 may be mounted on a first semiconductor chip20 (e.g., FIG. 1A). Alternatively, the second chip package P2 may bemounted on a first semiconductor chip 20 (e.g., FIG. 1B). Mounting thefirst chip package P1 or the second chip package P2 on the firstsemiconductor chip 20 may include joining the first bumps 105 to thefirst bump pads 24. A molding layer (not shown) may be formed so as tocover the first chip package P1, the first semiconductor chip 20, andthe PCB 10 so as to achieve the semiconductor package of FIG. 1A.Alternatively, a molding layer (not shown) may be formed so as to coverthe second chip package P2, the first semiconductor chip 20, and the PCB10 so as to achieve the semiconductor package of FIG. 1B. The moldinglayer may be formed of EMC.

According to example embodiments, a chip package may be directly mountedon a semiconductor chip. Even when the locations of the pads and thebumps of a logic device and a memory device are modified, an electricalconnection may still be achieved by means of an interposer.Consequently, a semiconductor package capable of relatively high-speedoperation may be realized, regardless of whether design modificationsmay need to be made in connection with a logic device and a memorydevice.

FIG. 4 is a cross-sectional view of a semiconductor package according toexample embodiments. Referring to FIG. 4, the semiconductor package mayinclude the printed circuit board (PCB) 10, a first semiconductor chip20′ and a chip package P1′. The lower substrate patterns 14 may bedisposed on the lower surface of the PCB 10. The solder balls 16 may beadhered to the lower substrate patterns 14. The solder balls 16 mayelectrically connect the PCB 10 to an external circuit. Upper substratepatterns 12 may be disposed on the upper surface of the PCB 10.

The first semiconductor chip 20′ may be disposed on the PCB 10. The PCBmay include, for example, an organic material such as, epoxy compound(e.g., FR4, BT), resin or polyimide. In an embodiment, the firstsemiconductor chip 20′ includes through hole vias 13 a, 13 b. Thethrough hole vias 13 a, 13 b pass through the first semiconductor chip20′. Solder balls 11 can be used to electrically connect the throughhole vias 13 a, 13 b and the upper substrate patterns 12. In anembodiment, the first semiconductor chip 20′ can be underfilled using,for example, an adhesive to provide a stronger mechanical connection. Aredistribution line 13 r can be provided on the first semiconductor chip20′ to electrically connect the through hole via 13 a and the chippackage P1′ through, for example, the first bump 105. As such, anelectrical path from the PCB 10 to the chip package P1′ is longer when asignal passes through the through hole via 13 a as compared when asignal passes through the through hole via 13 b. Accordingly, the shortpath using the through hole via 13 b can be used for providing signalswhile the long path using the through hole via 13 a can be used forproviding power or ground.

The first semiconductor chip 20′ may be a non-memory device (e.g., alogic device). The first bump pads 24 may be disposed on the uppersurface of the first semiconductor chip 20′. The first bump pads 24 maybe disposed near the center of the upper surface of the firstsemiconductor chip 20′. An active area can be formed on the lowersurface of the first semiconductor chip 20′. In an embodiment, an activearea can be formed on the upper surface of the first semiconductor chip20′.

The chip package P1′ may be directly connected to the firstsemiconductor chip 20′. The chip package P1′ may include a substrate(e.g., an interposer I′), the semiconductor chip group 120 a, and theencapsulation layer 140. The interposer I′ may electrically connect thefirst semiconductor chip 20′ and the semiconductor chip group 120 a. Asingle chip can be used instead of the semiconductor chip group 120 a.

The interposer I′ may include a PCB. The PCB may include, for example,an organic material such as, for example, an epoxy compound (e.g., FR4,BT), resin or polyimide.

Referring to FIGS. 1A and 4, I′ of FIG. 4 may be replaced as I of FIG.1A such that an interposer including the semiconductor substrate 100having the through-hole vias 110, the redistribution patterns 103connected to the through-hole vias 110, and first bumps 105 connected tothe redistribution patterns 103 can be used. The redistribution patterns103 may be disposed on an insulation layer on a lower surface of thesemiconductor substrate 100. The first bumps 105 may be disposed on thelower surface of the semiconductor substrate 100 so as to be connectedto the redistribution patterns 103 and the first bump pads 24 on thefirst semiconductor chip 20.

The semiconductor chip group 120 a may be disposed on the interposer I′.The semiconductor chip group 120 a may include the flip chip 122 a asthe second semiconductor chip, the third semiconductor chip 124 a, andthe fourth semiconductor chip 126 a. Second bumps 115 may be provided onthe lower surface of the flip chip 122 a. The second bumps 115 may beconnected to the through-hole vias 110. The flip chip 122 a, the thirdsemiconductor chip 124 a, and the fourth semiconductor chip 126 a may bememory devices. Adhesive layers may be interposed between the flip chip122 a and the third semiconductor chip 124 a and between the thirdsemiconductor chip 124 a and the fourth semiconductor chip 126 a.

The third semiconductor chip 124 a and the fourth semiconductor chip 126a may be electrically connected to the through-hole vias 110 by secondwires 132 and third wires 134, respectively. The encapsulation layer 140may be provided to cover the semiconductor chip group 120 a and theinterposer I′. The encapsulation layer 140 may include an epoxy moldingcompound (EMC). A molding layer 150, another form of an encapsulationlayer, may be provided to cover the encapsulation layer 140, the firstsemiconductor chip 20, and the PCB 10. The molding layer 150 may beformed of the same material as the encapsulation layer 140.Alternatively, the molding layer 150 may be formed of a differentmaterial from the encapsulation layer 140.

The semiconductor group 120 a can be disposed on the interposer I′ usingan adhesive therebetween.

FIG. 5 is a cross-sectional view of a semiconductor package according toexample embodiments. Referring to FIG. 5, a plurality of semiconductorchips 20 a, 20 b, 20 c, 20 d can be stacked on top of one another. Thesemiconductor chips can be of a same type. As such, respectivesemiconductor chips 20 a, 20 b, 20 c, 20 d can have substantially a samesize and a same thickness. According to an embodiment, semiconductorchips 20 a, 20 b, 20 c, 20 d include chips having a same function.According to an embodiment, respective semiconductor chips 20 a, 20 b,20 c, 20 d can have different sizes and thicknesses. According to anembodiment, semiconductor chips 20 a, 20 b, 20 c, 20 d include chipshaving different functions. Adhesive layers can be provided to jointogether adjacent semiconductor chips in the stack. According to anembodiment, solder ball bonding can be used to electrically connect thethrough hole vias 13 c, 13 d, 13 e, 13 f. The first bonding pads 22 onthe semiconductor chip 20 a may be electrically connected to the uppersubstrate patterns 12 on the PCB 10 by the first wires 26. The firstwires 26 can be omitted. According to an embodiment, the semiconductorchip 20 d can be disposed on the PCB 10 using an adhesive therebetween.

FIG. 6 is a cross-sectional view of a semiconductor package according toexample embodiments. Referring to FIG. 6, the first semiconductor chip20′ is underfilled using, for example, an adhesive 27 to provide astronger mechanical connection. In an embodiment, the interposer I′ canbe underfilled using, for example, an adhesive 25.

FIG. 7 is a cross-sectional view of a semiconductor package according toexample embodiments. Referring to FIG. 7, two different types ofsemiconductor chips 20L, 20H can be disposed on top of one another. Inan embodiment, the semiconductor chips 20L, 20H can have different chipsizes. Redistribution lines 13 rL, 13 rH can be provided to electricallyconnect upper and lower through hole vias 13 aH, 13 aL. In anembodiment, an adhesive layer can be provided to join together adjacentsemiconductor chips 20L, 20H in the stack. In an embodiment, solder ballbonding can be used to electrically connect upper and lower through holevias 13 bH, 13 bL. Solder balls 11 can be used to electrically connectthe through hole vias 13 aL, 13 bL and upper substrate patterns 12. Inan embodiment, the upper through hole via 13 aH is connected to thelower through hole via 13 aL through the redistribution layer 13 rL. Inan embodiment, an electrical path through the through hole vias 13 bH,13 bL is shorter than an electrical path through the through hole vias13 aH, 13 aL. The shorter path can be used to transmit signals while thelonger path can be used to transmit power or ground.

FIGS. 8-10 show a method of forming a semiconductor package according toexample embodiments.

Referring to FIG. 8, the PCB 10 including lower substrate patterns 14and upper substrate patterns 12 is provided. The solder balls 16 aredeposited on the lower substrate patterns 14. The upper substratepatterns 12 are provided to receive the solder balls 11.

Referring to FIG. 9 (A), a plurality of through hole vias 13 a, 13 b aredisposed substantially vertically in the first semiconductor chip 20′.Forming the through-hole vias 13 a, 13 b may include creating via holes17 in the first semiconductor chip 20′ with a laser drill and fillingthe via holes 17 with a conductive metal. The via holes 17 may be filledwith a conductive metal using an electroplating method.

Referring to FIG. 9(B), a plurality of bump pads can be disposed onrespective lower ends of the plurality through hole vias 13 a, 13 b. Aplurality of bump pads can be disposed on respective upper ends of theplurality through hole vias 13 a, 13 b. In an embodiment, a plurality ofredistribution lines 13 r can be disposed on the upper surface of thefirst semiconductor chip 20′ to be electrically connected with thethrough hole vias 13 a. Referring to FIG. 9(C), the solder balls 11 aredisposed on the respective bump pads of the lower surface of the firstsemiconductor chip 20′.

Referring to FIG. 10 (A), the interposer I′ including, for example, anorganic material such as, epoxy compound (e.g., FR4, BT), resin orpolyimide is provided. A plurality of bumps 105 are disposed on thelower surface of the substrate 100. The plurality of bump pads 24 andredistribution lines 13 r may receive respective bumps 105. Referring toFIG. 10(B), the semiconductor chip group 120 a or 120 b can be disposedon the upper surface of the interposer I′. Referring to FIG. 10(C), theencapsulation layer 140 can be disposed to cover the semiconductor chipgroup 120 a and the interposer I′.

In an embodiment, the first chip package P1′ may be mounted on the firstsemiconductor chip 20′. Mounting the first chip package P1′ on the firstsemiconductor chip 20′ may include joining the first bumps 105 to thefirst bump pads 24. A molding layer may be formed to cover the firstchip package P1′, the first semiconductor chip 20′, and the PCB 10 tomanufacture the semiconductor package of FIG. 4. The molding layer mayinclude EMC.

Although example embodiments have been described herein with referenceto the accompanying drawings, it is to be understood that the presentdisclosure should not be limited to these examples and that variousother changes and modifications may be affected therein by one ofordinary skill in the related art without departing from the scope orspirit of the invention. All such changes and modifications are intendedto be included within the scope of the inventions as defined by theappended claims.

1-18. (canceled)
 19. A method of forming a semiconductor package,comprising: mounting a first semiconductor chip on a package substrate;disposing a first conductive terminal on an upper surface of the firstsemiconductor chip; preparing a chip package including a siliconsubstrate and through-hole vias in the silicon substrate, a secondsemiconductor chip on an upper surface of the silicon substrate, and asecond conductive terminal on a lower surface of the silicon substrate;and mounting the chip package on the first semiconductor chip such thatthe first conductive terminal contacts the second conductive terminal.20. The method of claim 19, wherein preparing the chip package furthercomprises: mounting a second semiconductor chip on the silicon substrateas a flip chip; and mounting a third semiconductor chip on the secondsemiconductor chip.
 21. The method of claim 20, wherein the siliconsubstrate is prepared by: forming redistribution patterns on a lowersurface of the semiconductor substrate, the redistribution patternsbeing connected to the through-hole vias; and forming the secondconductive terminal on the lower surface of the semiconductor substrate,the second conductive terminal including first bumps connected to theredistribution patterns.
 22. The method of claim 21, wherein: the firstconductive terminal includes first bump pads on an upper surface of thefirst semiconductor chip; and mounting the chip package on the firstsemiconductor chip includes connecting the first bumps to the first bumppads.
 23. The method of claim 21, wherein: the third semiconductor chipincludes bonding pads, and preparing the chip package includeselectrically connecting the bonding pads and the through-hole vias withbonding wires.
 24. The method of claim 21, wherein: the secondsemiconductor chip includes second bumps on a lower surface of thesecond semiconductor chip; and mounting the second semiconductor chip onthe silicon substrate includes connecting the second bumps to thethrough-hole vias.
 25. The method of claim 20, further comprising:forming an encapsulation layer on the third semiconductor chip, thesecond semiconductor chip, and the silicon substrate.
 26. The method ofclaim 19, further comprising: forming a molding layer on the chippackage, the first semiconductor chip, and the package substrate. 27.The method of claim 19, wherein the chip package includes memorydevices, and the first semiconductor chip includes a non-memory device.28. The method of claim 19, wherein preparing the chip package includes:stacking a plurality of semiconductor chips; and forming penetrationinterconnections within the plurality of semiconductor chips, thepenetration interconnections extending through and electricallyconnecting the plurality of semiconductor chips.